BECOM Sentis3D M520 - Multipix Imaging
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BECOM Sentis3D M520

Time-of-Flight 3D and 2D camera in kit form, ideal for OEM’s

  • Resolution in 3D 160 x 120 (ToF)
  • Resolution in 2D 1080p (RGB)
  • FoV 90°
  • FPS  – 3D up to 160 fps
  • PoE++ Support (60 W)
  • Range 0.1 to 5m Indoor

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For pricing and more details, get in touch with one of our friendly machine vision experts.

Dual sensor: Time-of-Flight 3D with 2D camera Module Kit

The Sentis3D–M520 Kit offers flexibility through different Field-of-Views and supporting applications with a range up to 5 m. In addition a high resolution 2D colour sensor provides combined 2D/3D data. An onboard Quad-Core ARM processor can run custom algorithms on the camera. The Sentis3D–M520 Kit can be used for a wide range of application scenarios and enable a fast transition from evaluation to application development.

These Kits are targeted at customers working to integrate ToF modules into their own design.


CPU4 x Cores Cortex A9
Flash4 GByte eMMC
General Information
Application Range3 m Outdoor
PoE Support60 W PoE++
Width130 mm
Height95 mm
Depth40 mm
Application Range5 m Indoor
Power Supply30 VDC
Weight350 g
Image Sensor
Depth Sensing TechnologyTime of Flight (ToF)
Sensor Name1 x PMD PhotonICs® 19k-S3
Optical Information
FPS160 (3D depends on configuration)
FPS30 (2D depends on configuration)
Resolution160 Pixel
FoV90 °
# LEDs12 x 850 nm LEDs
Imager1,080 Pixel OV5640 (CMOS)
Resolution120 Pixel
Communication1 x ETH (Gbit/s)
Control1 x Owire

I/O Interface : 1 x Externes Sync Interface (Modulation Interface (LVDS)) , 1 x Trigger In , 1 x Trigger Out , 1 x GPIO (galvanic isolated)