Dual sensor: Time-of-Flight 3D with 2D camera Module Kit
The Sentis3D–M520 Kit offers flexibility through different Field-of-Views and supporting applications with a range up to 5 m. In addition a high resolution 2D colour sensor provides combined 2D/3D data. An onboard Quad-Core ARM processor can run custom algorithms on the camera. The Sentis3D–M520 Kit can be used for a wide range of application scenarios and enable a fast transition from evaluation to application development.
These Kits are targeted at customers working to integrate ToF modules into their own design.
FEATURES AT A GLANCE
| CPU | |
|---|---|
| CPU | 4 x Cores Cortex A9 |
| RAM | 2 GByte DDR3 |
| Flash | 4 GByte eMMC |
| General Information | |
| Application Range | 3 m Outdoor |
| Cooling | Passive |
| PoE Support | 60 W PoE++ |
| Width | 130 mm |
| Height | 95 mm |
| Depth | 40 mm |
| Application Range | 5 m Indoor |
| Power Supply | 30 VDC |
| Weight | 350 g |
| Image Sensor | |
| Depth Sensing Technology | Time of Flight (ToF) |
| Sensor Name | 1 x PMD PhotonICs® 19k-S3 |
| Optical Information | |
| FPS | 160 (3D depends on configuration) |
| FPS | 30 (2D depends on configuration) |
| Resolution | 160 Pixel |
| FoV | 90 ° |
| # LEDs | 12 x 850 nm LEDs |
| Imager | 1,080 Pixel OV5640 (CMOS) |
| Resolution | 120 Pixel |
| Interfaces | |
| Communication | 1 x ETH (Gbit/s) |
| Control | 1 x Owire |
I/O Interface : 1 x Externes Sync Interface (Modulation Interface (LVDS)) , 1 x Trigger In , 1 x Trigger Out , 1 x GPIO (galvanic isolated)