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Megapixel board level OEM thermal imaging camera
Board level OEM thermal imaging camera
Small, high performance uncooled thermal camera module
Single board camera, flexible design using latest sensor technology
FUSION cameras feature three separate multispectral wavebands that enables the simultaneous capture of a 1.6MP mono image plus 1.6MP images from two separate near-infrared bands!
Quickly building machine vision applications without programming. With MERLIC 4.7, MVTec have based the updates on three areas; Connectivity, Camera Handling and General Improvements.
Get the most from your CoaXPress Camera, with Four CoaXPress CXP-12 connections – 5,000 MB/s camera bandwidth, PCIe 3.0 x8 bus – 6,700 MB/s bus bandwidth, 20 digital I/O lines, extensive camera functions and more…
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